GENEVA, May 13 -- FURUKAWA ELECTRIC CO.,LTD. (6-4, Otemachi 2-chome, Chiyoda-ku, Tokyo1008322), 古河電気工業株式会社 (東京都千代田区大手町二丁目6番4号) filed a patent application (PCT/JP2024/038414) for "ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE AND SEMICONDUCTOR PACKAGE USING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE" on Oct 28, 2024. With publication no. WO/2025/094910, the details related to the patent application was published on May 08, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is mana...