GENEVA, April 7 -- FURUKAWA CO., LTD. (6-4, Otemachi 2-chome, Chiyoda-ku, Tokyo1008370), 古河機械金属株式会社 (東京都千代田区大手町二丁目6番4号) filed a patent application (PCT/JP2024/024589) for "COPPER PARTICLE, METHOD FOR PRODUCING COPPER PARTICLE, CONDUCTIVE PASTE, AND SUBSTRATE" on Jul 08, 2024. With publication no. WO/2025/069638, the details related to the patent application was published on Apr 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organizatio...