GENEVA, May 18 -- FUJIKURA LTD. (1-5-1, Kiba, Koto-ku, Tokyo1358512), 株式会社フジクラ (東京都江東区木場１－５－１) filed a patent application (PCT/JP2024/030440) for "SEMICONDUCTOR PACKAGE AND RF MODULE" on Aug 27, 2024. With publication no. WO/2025/100041, the details related to the patent application was published on May 15, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): TOMITA Michikazu (c/o Fujikura Ltd., Sakura Works, 1440, Mutsuzaki, Sakura-shi, Chiba2858550),...