GENEVA, July 2 -- FUJIKURA LTD. (1-5-1, Kiba, Koto-ku, Tokyo1358512), 株式会社フジクラ (東京都江東区木場１－５－１) filed a patent application (PCT/JP2024/033534) for "SEMICONDUCTOR PACKAGE" on Sep 19, 2024. With publication no. WO/2025/134451, the details related to the patent application was published on Jun 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): TAKEDA Shinogu (c/o Fujikura Ltd., Sakura Works, 1440, Mutsuzaki, Sakura-shi, Chiba2858550), 武田...