GENEVA, May 28 -- FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (80 Circuit DriveN. Kingstown, Rhode Island 02852) filed a patent application (PCT/US2024/055063) for "ETCHING METHODS" on Nov 08, 2024. With publication no. WO/2025/106343, the details related to the patent application was published on May 22, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): PARK, Keeyoung (2200 E Iris DriveChandler, Arizona 85286), BJELOPAVLIC, Mick (3831 E San Mateo WayChandler, Arizona 85249)
Abstract:
The present disclosure is directed to etching methods that are useful for, e.g., selectively removing silico...