INTERNATIONAL PATENT: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. FILES APPLICATION FOR "ETCHING COMPOSITIONS"

GENEVA, Oct. 1 -- FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (80 Circuit DriveN. Kingstown, Rhode Island 02852) filed a patent application (PCT/US2025/020187) for "ETCHING COMPOSITIONS" on Mar 17, 2025. With publication no. WO/2025/199009, the details related to the patent application was published on Sep 25, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DINEGA, Dmitry (4120 S Emery StreetMesa, Arizona 85212)

Abstract: The present disclosure is directed to etching compositions that are useful for, e.g., selectively removing sacrificial light absorbing material (SLAM) from a semiconductor ...