INTERNATIONAL PATENT: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. FILES APPLICATION FOR "DIELECTRIC FILM-FORMING COMPOSITION"

GENEVA, March 4 -- FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (80 Circuit DriveN. Kingstown, Rhode Island 02852) filed a patent application (PCT/US2024/043012) for "DIELECTRIC FILM-FORMING COMPOSITION" on Aug 20, 2024. With publication no. WO/2025/042879, the details related to the patent application was published on Feb 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DE, Binod B. (3 Stanley StreetAttleboro, Massachusetts 02703)

Abstract: This disclosure relates to a dielectric film-forming composition that includes (a) at least one resin selected from the group consisting of: i) a fu...