INTERNATIONAL PATENT: FUJIFILM CORPORATION, FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. FILES APPLICATION FOR "KIT AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE"

GENEVA, July 3 -- FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome, Minato-ku, Tokyo1068620), FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (6550 S Mountain Rd, Mesa Arizona85212) filed a patent application (PCT/JP2024/043720) for "KIT AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE" on Dec 11, 2024. With publication no. WO/2025/134878, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KAMIMURA Tetsuya (c/o FUJIFILM Corporation., 4000, Kawashiri, Yoshida-cho, Haibara-gun, Shizuoka4210396), MIZUTANI Atsushi (c/o FUJIFILM Corpora...