GENEVA, July 8 -- FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome, Minato-ku, Tokyo1068620), 富士フイルム株式会社 (東京都港区西麻布２丁目２６番３０号) filed a patent application (PCT/JP2024/042212) for "SEMICONDUCTOR DEVICE PROCESSING COMPOSITION, METHOD FOR MANUFACTURING MODIFIED SUBSTRATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE" on Nov 28, 2024. With publication no. WO/2025/142299, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the International Patent Cla...