INTERNATIONAL PATENT: FUJIFILM CORPORATION, 富士フイルム株式会社 FILES APPLICATION FOR "RESIN COMPOSITION, CURED OBJECT, LAMINATE, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND COMPOUND"

GENEVA, March 25 -- FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome, Minato-ku, Tokyo1068620), 富士フイルム株式会社 (東京都港区西麻布２丁目２６番３０号) filed a patent application (PCT/JP2024/032265) for "RESIN COMPOSITION, CURED OBJECT, LAMINATE, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND COMPOUND" on Sep 09, 2024. With publication no. WO/2025/057914, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the Interna...