GENEVA, Sept. 30 -- FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome, Minato-ku, Tokyo1068620), 富士フイルム株式会社 (東京都港区西麻布２丁目２６番３０号) filed a patent application (PCT/JP2025/007422) for "COMPOSITION FOR SEMICONDUCTOR DEVICE PROCESSING, METHOD FOR MANUFACTURING MODIFIED SUBSTRATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE" on Mar 03, 2025. With publication no. WO/2025/197512, the details related to the patent application was published on Sep 25, 2025.
Notably, the patent application was submitted under the International Pate...