INTERNATIONAL PATENT: FENNER, INC. FILES APPLICATION FOR "THERMALLY CONDUCTIVE INTERFACE DESIGN"

GENEVA, April 21 -- FENNER, INC. (187 West Airport RoadLititz, PA 17543) filed a patent application (PCT/US2024/051207) for "THERMALLY CONDUCTIVE INTERFACE DESIGN" on Oct 14, 2024. With publication no. WO/2025/081148, the details related to the patent application was published on Apr 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NENE, Omkar (The Annexe56 Roman WharfLincoln, Lincolnshire LN1 1SR), HASSAN, Sammi (31 Spire CloseLincoln, Lincolnshire LN1 3QE), WILKINSON, Mark (25 Spa StreetLincoln, Lincolnshire LN2 5NQ)

Abstract: A thermally conductive interface device produced from a t...