GENEVA, Aug. 26 -- FCI USA LLC (825 Old Trail RoadEtters, PA 17319) filed a patent application (PCT/US2025/015745) for "HIGH SPEED AND HIGH DENSITY NEAR CHIP CONNECTOR" on Feb 13, 2025. With publication no. WO/2025/174977, the details related to the patent application was published on Aug 21, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MILBRAND, Donald W. Jr. (22 Hemp Hill RoadBristol, NH 03222), HARMON, Dean III (825 Old Trail RoadEtters, PA 17319), REN, Huilin (15 Tinker RoadMerrimack, NH 03054)
Abstract:
A dense, high speed pressure mount connector suitable for near chip applicatio...