INTERNATIONAL PATENT: FANUC CORPORATION, ファナック株式会社 FILES APPLICATION FOR "THICKNESS PREDICTION DEVICE AND THICKNESS PREDICTION METHOD FOR SURFACE-MODIFIED LAYER"

GENEVA, June 10 -- FANUC CORPORATION (3580, Shibokusa Aza-Komanba, Oshino-mura, Minamitsuru-gun, Yamanashi4010597), ファナック株式会社 (山梨県南都留郡忍野村忍草字古馬場３５８０番地) filed a patent application (PCT/JP2023/042803) for "THICKNESS PREDICTION DEVICE AND THICKNESS PREDICTION METHOD FOR SURFACE-MODIFIED LAYER" on Nov 29, 2023. With publication no. WO/2025/115142, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, whic...