INTERNATIONAL PATENT: FANG, JUN, 方军 FILES APPLICATION FOR "LED LIGHT-EMITTING TUBE CHIP STEPPED-LAYER PACKAGING STRUCTURE AND PREPARATION PROCESS THEREFOR"

GENEVA, May 26 -- FANG, Jun (Room 302, Building B34, Western Industrial Zone, Tantou Community, Songgang Street, Bao'an DistrictShenzhen, Guangdong 518000), 方军 (中国广东省深圳市宝安区松岗街道潭头社区西部工业区B34栋厂房302) filed a patent application (PCT/CN2024/131167) for "LED LIGHT-EMITTING TUBE CHIP STEPPED-LAYER PACKAGING STRUCTURE AND PREPARATION PROCESS THEREFOR" on Nov 11, 2024. With publication no. WO/2025/103247, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International ...