GENEVA, June 12 -- EVATEC AG (Hauptstr. 1a9477 Trubbach) filed a patent application (PCT/EP2024/083559) for "METHOD AND DEVICE FOR DEPOSITING A CHEMICALLY MODIFIED METAL FILM" on Nov 26, 2024. With publication no. WO/2025/114255, the details related to the patent application was published on Jun 05, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): TSCHIRKY, Thomas (Feldackerstrasse 428887 Mels), JAGER, Dominik (Susenbuhlstrasse 507000 Chur)
Abstract:
The present invention pertains to a method comprising the steps of depositing a metal film on a surface of a substrate by sputtering from a m...