GENEVA, Feb. 24 -- EV GROUP E. THALLNER GMBH (DI Erich Thallner StraBe 14782 St. Florian am Inn) filed a patent application (PCT/EP2023/072600) for "METHOD FOR BONDING A FIRST SUBSTRATE TO A SECOND SUBSTRATE, DEVICE FOR BONDING AND ASSEMBLY OF A FIRST AND SECOND SUBSTRATE" on Aug 16, 2023. With publication no. WO/2025/036559, the details related to the patent application was published on Feb 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): FEHKUHRER, Andreas (DI Erich Thallner StraBe 14782 St. Florian am Inn)
Abstract:
A method for bonding a first substrate (2u) to a second substrate (...