INTERNATIONAL PATENT: ETH ZURICH FILES APPLICATION FOR "THREE-DIMENSIONAL DEPOSITION OF A DEPOSITION STRUCTURE ON A SUBSTRATE"

GENEVA, Jan. 5 -- ETH ZURICH (Raemistrasse 101 / ETH transfer8092 Zurich) filed a patent application (PCT/EP2025/068107) for "THREE-DIMENSIONAL DEPOSITION OF A DEPOSITION STRUCTURE ON A SUBSTRATE" on Jun 26, 2025. With publication no. WO/2026/003188, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHIH, Chih-Jen (Krahbuhlstrasse 538044 Zurich), OH, Jiwoo (Schumacherweg 258046 Zurich), ZENG, Shuangshuang (Luoyu Road 1037Wuhan, Hubei 430074)

Abstract: A method of producing a deposition structure (1) on a substrate (2) comp...