INTERNATIONAL PATENT: ESSEX SOLUTIONS USA LLC FILES APPLICATION FOR "ALTERNATIVE SOLVENT BLENDS FOR USE IN FORMING AND APPLYING THERMOSETTING POLYAMIDE-IMIDE"

GENEVA, Nov. 19 -- ESSEX SOLUTIONS USA LLC (5770 Powers Ferry Rd NWSuite 400Atlanta, Georgia 30327) filed a patent application (PCT/US2025/028317) for "ALTERNATIVE SOLVENT BLENDS FOR USE IN FORMING AND APPLYING THERMOSETTING POLYAMIDE-IMIDE" on May 08, 2025. With publication no. WO/2025/235712, the details related to the patent application was published on Nov 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): XU, Shengqing (3072 Leon CoveFort Wayne, Indiana 46845), MCFARLAND, Frederick (336 W Washington Center RoadApt. BFort Wayne, Indiana 46825), LEACH, Matthew E. (1236 Timberlake TrailFo...