INTERNATIONAL PATENT: ERIDU CORPORATION FILES APPLICATION FOR "SCALABLE THREE-DIMENSIONAL PROCESSING ARCHITECTURE AND PACKAGE"

GENEVA, Dec. 11 -- ERIDU CORPORATION (12900 Saratoga Ave.Saratoga, CA 95070) filed a patent application (PCT/US2025/031820) for "SCALABLE THREE-DIMENSIONAL PROCESSING ARCHITECTURE AND PACKAGE" on May 30, 2025. With publication no. WO/2025/251054, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHIANG, Ting-Kuang (c/o Eridu AI12900 Saratoga Ave.Saratoga, CA 95070), PERKINS, Drew (c/o Eridu AI12900 Saratoga Ave.Saratoga, CA 95070)

Abstract: Consistent with the present disclosure, a scalable high density package is provided...