INTERNATIONAL PATENT: ENCLUSTRA GMBH FILES APPLICATION FOR "HEAT SPREADER, ELECTRONIC MODULE, ELECTRONIC ASSEMBLY, METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY"

GENEVA, Oct. 4 -- ENCLUSTRA GMBH (Raffelstrasse 288045 Zurich) filed a patent application (PCT/EP2025/056785) for "HEAT SPREADER, ELECTRONIC MODULE, ELECTRONIC ASSEMBLY, METHOD FOR MANUFACTURING AN ELECTRONIC MODULE, AND METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY" on Mar 12, 2025. With publication no. WO/2025/201887, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HEIMLICHER, Martin Andreas (Raffelstrasse 288045 Zurich), THIBERVILLE, Vincent (Raffelstrasse 288045 Zurich)

Abstract: The present application relates to ...