INTERNATIONAL PATENT: EKC TECHNOLOGY, INC. FILES APPLICATION FOR "CONDUCTIVE COMPOSITES, INKS AND ADHESIVES WITH LOW SILVER NANO WIRE LOADING AND LOW RESISTIVITY AND METHODS FOR FORMING CONDUCTIVE FEATURES"

GENEVA, Aug. 19 -- EKC TECHNOLOGY, INC. (2520 Barrington CourtHayward, California 94545) filed a patent application (PCT/US2025/014800) for "CONDUCTIVE COMPOSITES, INKS AND ADHESIVES WITH LOW SILVER NANO WIRE LOADING AND LOW RESISTIVITY, AND METHODS FOR FORMING CONDUCTIVE FEATURES" on Feb 06, 2025. With publication no. WO/2025/171139, the details related to the patent application was published on Aug 14, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): VIRKAR, Ajay (510 S Idaho Street, Unit ASan Mateo, California 94402), TORK, Amir (22140 Castille Lane #75Hayward, California 94541), UDDIN, Na...