INTERNATIONAL PATENT: EEJA LTD., ＥＥＪＡ株式会社 FILES APPLICATION FOR "SUBSTRATE FOR ELECTROLESS PLATING, ELECTROLESS PLATING STRUCTURE AND ELECTROLESS PLATING METHOD"

GENEVA, Dec. 30 -- EEJA LTD. (2-6-6 Nihonbashi Kayabacho, Chuo-ku, Tokyo1030025), ＥＥＪＡ株式会社 (東京都中央区日本橋茅場町二丁目６番６号) filed a patent application (PCT/JP2025/020944) for "SUBSTRATE FOR ELECTROLESS PLATING, ELECTROLESS PLATING STRUCTURE, AND ELECTROLESS PLATING METHOD" on Jun 10, 2025. With publication no. WO/2025/263394, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organiza...