INTERNATIONAL PATENT: EDSCHA MECHATRONICS SOLUTIONS GMBH FILES APPLICATION FOR "FLAP ARRANGEMENT, AUTOMOBILE HAVING SUCH A FLAP ARRANGEMENT AND METHOD FOR RELEASING OR CLOSING AN OPENING"

GENEVA, April 14 -- EDSCHA MECHATRONICS SOLUTIONS GMBH (Hohenhagener Str. 26-2842855 Remscheid) filed a patent application (PCT/DE2024/100862) for "FLAP ARRANGEMENT, AUTOMOBILE HAVING SUCH A FLAP ARRANGEMENT AND METHOD FOR RELEASING OR CLOSING AN OPENING" on Oct 02, 2024. With publication no. WO/2025/073319, the details related to the patent application was published on Apr 10, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NICOLAISEN, Arndt (c/o Edscha Mechatronics Solutions GmbHHohenhagener Str. 26 - 2842855 Remscheid), BOEHM, Markus (c/o Edscha Mechatronics Solutions GmbHHohenhagener Str...