INTERNATIONAL PATENT: ECOPIA TECH CORPORATION FILES APPLICATION FOR "PLATFORM FOR DISTRIBUTED LANDCOVER FEATURE DATA REVIEW"

GENEVA, Feb. 3 -- ECOPIA TECH CORPORATION (101 College Street, Suite 440Toronto, Ontario M5G 1L7) filed a patent application (PCT/IB2024/052277) for "PLATFORM FOR DISTRIBUTED LANDCOVER FEATURE DATA REVIEW" on Mar 08, 2024. With publication no. WO/2025/022182, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHU, Yuanming (c/o Ecopia Tech Corporation101 College Street, Suite 440Toronto, Ontario M5G 1L7), TAN, Shuo (c/o Ecopia Tech Corporation101 College Street, Suite 440Toronto, Ontario M5G 1L7), ZHAO, Tuan (c/o Ecopia Tech...