INTERNATIONAL PATENT: EBARA CORPORATION, 株式会社荏原製作所 FILES APPLICATION FOR "SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE"

GENEVA, Nov. 3 -- EBARA CORPORATION (11-1, Haneda Asahi-cho, Ota-ku, Tokyo1448510), 株式会社荏原製作所 (東京都大田区羽田旭町１１番１号) filed a patent application (PCT/JP2025/012449) for "SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE" on Mar 27, 2025. With publication no. WO/2025/225265, the details related to the patent application was published on Oct 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TAKENAKA, Hiroyuki (c/o Ebara Co...