INTERNATIONAL PATENT: EBARA CORPORATION, 株式会社荏原製作所 FILES APPLICATION FOR "SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD"

GENEVA, Aug. 5 -- EBARA CORPORATION (11-1, Haneda Asahi-cho, Ota-ku, Tokyo1448510), 株式会社荏原製作所 (東京都大田区羽田旭町１１番１号) filed a patent application (PCT/JP2025/001291) for "SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD" on Jan 17, 2025. With publication no. WO/2025/159011, the details related to the patent application was published on Jul 31, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FUJIKATA, Jumpei (c/o Ebara Corp...