GENEVA, June 3 -- EBARA CORPORATION (11-1, Haneda Asahi-cho, Ota-ku, Tokyo1448510), 株式会社荏原製作所 (東京都大田区羽田旭町11番1号) filed a patent application (PCT/JP2024/038133) for "SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD" on Oct 25, 2024. With publication no. WO/2025/109944, the details related to the patent application was published on May 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KODERA, Kenji (c/o Ebara Corpora...