INTERNATIONAL PATENT: EBARA CORPORATION, 株式会社荏原製作所 FILES APPLICATION FOR "SUBSTRATE BONDING METHOD AND SUBSTRATE BONDING SYSTEM"

GENEVA, Oct. 13 -- EBARA CORPORATION (11-1, Haneda Asahi-cho, Ota-ku, Tokyo1448510), 株式会社荏原製作所 (東京都大田区羽田旭町１１番１号) filed a patent application (PCT/JP2024/041556) for "SUBSTRATE BONDING METHOD AND SUBSTRATE BONDING SYSTEM" on Nov 25, 2024. With publication no. WO/2025/210956, the details related to the patent application was published on Oct 09, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHAMOTO, Mitsuhiro (c/o Ebara Corpora...