INTERNATIONAL PATENT: E5 INCORPORATED FILES APPLICATION FOR "FORMULATIONS INCORPORATING THERMOPLASTIC MICROSPHERES THEREIN"

GENEVA, Nov. 26 -- E5 INCORPORATED (1718 Pleasant StreetNoblesville, IN 46060) filed a patent application (PCT/US2025/029832) for "FORMULATIONS INCORPORATING THERMOPLASTIC MICROSPHERES THEREIN" on May 16, 2025. With publication no. WO/2025/240903, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHETTERLEY, William, Archie Joseph (10038 S. 750 W.Fortville, IN 46040)

Abstract: Formulations incorporating thermoplastic microspheres therein. A method is disclosed herein, including the step of combining a quantity of amorphous...