INTERNATIONAL PATENT: E-CON PACKAGING PVT. LTD. FILES APPLICATION FOR "AN ELLIPTICAL SHAPED METAL DRUM COMPONENT AND AN APPARATUS FOR MAKING THE SAME"

GENEVA, Feb. 3 -- E-CON PACKAGING PVT. LTD. (21/1, Rikhav, R. A. Kidwai Road,Wadala West, Mumbai,Maharashtra-400031) filed a patent application (PCT/IN2025/050383) for "AN ELLIPTICAL SHAPED METAL DRUM COMPONENT AND AN APPARATUS FOR MAKING THE SAME" on Mar 17, 2025. With publication no. WO/2026/022839, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): THACKER, Hitesh (c/o: E-con Packaging Pvt. Ltd.21/1, Rikhav, R. A. Kidwai Road,Wadala West, Mumbai,Maharashtra-400031), THACKER, Neil (c/o: E-con Packaging Pvt. Ltd.21/1, Rikha...