INTERNATIONAL PATENT: DSTAR COMMUNICATIONS, INC. FILES APPLICATION FOR "HIGH DENSITY INTERCONNECTS WITH 3D BROADBAND ELECTROOPTIC INFRARED COMPONENTS"

GENEVA, Jan. 6 -- DSTAR COMMUNICATIONS, INC. (4531 Dulcinea Ct.Woodland Hills, California 91364) filed a patent application (PCT/US2025/026236) for "HIGH DENSITY INTERCONNECTS WITH 3D BROADBAND ELECTROOPTIC INFRARED COMPONENTS" on Apr 24, 2025. With publication no. WO/2026/005878, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): STARODUBOV, Dmitry (4531 Dulcinea Ct.Woodland Hills, California 91364)

Abstract: Embodiments of the present disclosure include optical elements and methods of forming the same using light-based pa...