GENEVA, May 27 -- DS SMITH PACKAGING LIMITED (Level 3, 1 Paddington SquareLONDON W2 1DL) filed a patent application (PCT/IB2024/061333) for "DEVICE AND METHOD FOR BONDING A PLASTIC INLAY TO A BLANK TO FORM A TRAY AND TRAY THEREWITH" on Nov 14, 2024. With publication no. WO/2025/104639, the details related to the patent application was published on May 22, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): NAGEL, Andreas (c/o DS SMITH PACKAGING LIMITEDLevel 3, 1 Paddington SquareLONDON W2 1DL), RUHLAND, Reinhard (c/o DS SMITH PACKAGING LIMITEDLevel 3, 1 Paddington SquareLONDON W2 1DL)
Abstract:...