INTERNATIONAL PATENT: DOW GLOBAL TECHNOLOGIES LLC FILES APPLICATION FOR "TIE LAYERS COMPRISING FUNCTIONALIZED POLYETHYLENE AND MULTILAYER STRUCTURES INCORPORATING SAME"

GENEVA, Aug. 12 -- DOW GLOBAL TECHNOLOGIES LLC (2211 H.H. Dow WayMidland, Michigan 48674) filed a patent application (PCT/US2025/012719) for "TIE LAYERS COMPRISING FUNCTIONALIZED POLYETHYLENE AND MULTILAYER STRUCTURES INCORPORATING SAME" on Jan 23, 2025. With publication no. WO/2025/165636, the details related to the patent application was published on Aug 07, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BURMISTROV, Sviatoslav (Rheingaustr 3465201 Weisbaden), DONG, Yifan (c/o The Dow Chemical Company230 Abner Jackson ParkwayLake Jackson, Texas 77566), MARKS, Scott B. (200 Powder Mill Road...