INTERNATIONAL PATENT: DOW GLOBAL TECHNOLOGIES LLC FILES APPLICATION FOR "THERMALLY CONDUCTIVE COMPOSITIONS WITH ADHESIVE STRENGTH"

GENEVA, Sept. 17 -- DOW GLOBAL TECHNOLOGIES LLC (2211 H.H. Dow WayMidland, Michigan 48674) filed a patent application (PCT/US2025/018318) for "THERMALLY CONDUCTIVE COMPOSITIONS WITH ADHESIVE STRENGTH" on Mar 04, 2025. With publication no. WO/2025/188737, the details related to the patent application was published on Sep 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AGARWAL, Praveen (230 Abner Jackson ParkwayLake Jackson, Texas 77566), JIRA, Edward (230 Abner Jackson ParkwayLake Jackson, Texas 77566), DOUGLAS, Lacey (230 Abner Jackson ParkwayLake Jackson, Texas 77566), SHAH, Harshad M. ...