GENEVA, April 21 -- DOOSAN CORPORATION (275 Jangchungdan-roJung-guSeoul 04563), 주식회사 두산 (서울특별시중구장충단로 275) filed a patent application (PCT/KR2024/015371) for "RESIN COMPOSITION, AND PREPREG, METAL-CLAD LAMINATE, LAMINATED SHEET, AND PRINTED CIRCUIT BOARD EACH USING SAME" on Oct 11, 2024. With publication no. WO/2025/080003, the details related to the patent application was published on Apr 17, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): LEE, Sanghwan ((Seongbok-dong) 10, ...