INTERNATIONAL PATENT: DOKA GMBH FILES APPLICATION FOR "FORMWORK PANEL HAVING REDUCED THERMAL EXPANSION AND IMPROVED RESISTANCE TO SWELLING"

GENEVA, April 14 -- DOKA GMBH (Josef Umdasch Platz 13300 Amstetten) filed a patent application (PCT/EP2024/077819) for "FORMWORK PANEL HAVING REDUCED THERMAL EXPANSION AND IMPROVED RESISTANCE TO SWELLING" on Oct 03, 2024. With publication no. WO/2025/073818, the details related to the patent application was published on Apr 10, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HEILMANN, Christoph (Mitter-Pabneukirchen 184363 Pabneukirchen), STRANNER, Jurgen (Leoben 139861 Eisentratten), HANSEN, Sven Andre (Zillerstrasse 801445 Radebeul)

Abstract: The invention relates to a formwork panel (3...