INTERNATIONAL PATENT: DISCO CORPORATION, 株式会社ディスコ FILES APPLICATION FOR "CUTTING TOOL AND METHOD FOR MANUFACTURING CUTTING TOOL"

GENEVA, Oct. 27 -- DISCO CORPORATION (13-11, Omori-Kita 2-chome, Ota-ku, Tokyo1438580), 株式会社ディスコ (東京都大田区大森北二丁目１３番１１号) filed a patent application (PCT/JP2025/014693) for "CUTTING TOOL AND METHOD FOR MANUFACTURING CUTTING TOOL" on Apr 14, 2025. With publication no. WO/2025/220635, the details related to the patent application was published on Oct 23, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KIMURA Yutaka (c/...