INTERNATIONAL PATENT: DIP CORPORATION, ディップ株式会社 FILES APPLICATION FOR "PAYMENT AMOUNT DETERMINATION DEVICE, PAYMENT AMOUNT DETERMINATION METHOD AND PAYMENT AMOUNT DETERMINATION PROGRAM"

GENEVA, Aug. 11 -- DIP CORPORATION (Roppongi Grand Tower 31F, 3-2-1, Roppongi, Minato-ku, Tokyo1066231), ディップ株式会社 (東京都港区六本木３－２－１　六本木グランドタワー３１Ｆ) filed a patent application (PCT/JP2024/009961) for "PAYMENT AMOUNT DETERMINATION DEVICE, PAYMENT AMOUNT DETERMINATION METHOD, AND PAYMENT AMOUNT DETERMINATION PROGRAM" on Mar 14, 2024. With publication no. WO/2025/163925, the details related to the patent application was published on Aug 07, 2025.

Notably, the patent application was submitted under the Inter...