INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "TWO-PART CURABLE ADHESIVE, LAMINATE AND PACKAGING MATERIAL"

GENEVA, Feb. 3 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/023947) for "TWO-PART CURABLE ADHESIVE, LAMINATE, AND PACKAGING MATERIAL" on Jul 03, 2025. With publication no. WO/2026/023368, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KIMURA Sakiko (c/o DIC Corp...