INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "TWO-COMPONENT CURABLE ADHESIVE, LAMINATED BODY AND PACKING MATERIAL"

GENEVA, April 28 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2024/035362) for "TWO-COMPONENT CURABLE ADHESIVE, LAMINATED BODY, AND PACKING MATERIAL" on Oct 03, 2024. With publication no. WO/2025/084144, the details related to the patent application was published on Apr 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YAMADA Shinjiro ...