INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "POLYARYLENE SULFIDE RESIN COMPOSITION AND MOLDED ARTICLE AND METHODS FOR PRODUCING SAME"

GENEVA, Sept. 30 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/008141) for "POLYARYLENE SULFIDE RESIN COMPOSITION AND MOLDED ARTICLE, AND METHODS FOR PRODUCING SAME" on Mar 06, 2025. With publication no. WO/2025/197579, the details related to the patent application was published on Sep 25, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(...