INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "POLYARYLENE SULFIDE RESIN COMPOSITION, MOLDED ARTICLE, COMPOSITE AND PRODUCTION METHODS THEREFOR"

GENEVA, Feb. 17 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2024/026546) for "POLYARYLENE SULFIDE RESIN COMPOSITION, MOLDED ARTICLE, COMPOSITE, AND PRODUCTION METHODS THEREFOR" on Jul 25, 2024. With publication no. WO/2025/033188, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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