GENEVA, Jan. 5 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/014723) for "METHOD FOR PRODUCING MOLDED ARTICLE" on Apr 14, 2025. With publication no. WO/2026/004312, the details related to the patent application was published on Jan 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SENTE Yasuhiro (c/o DIC Corporation, Tokyo Plant, 35...