GENEVA, Dec. 16 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/018492) for "LAMINATE, PACKAGING MATERIAL, AND RECYCLING METHOD" on May 22, 2025. With publication no. WO/2025/253915, the details related to the patent application was published on Dec 11, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KIMURA Ryoji (c/o DIC Corporation, ...