GENEVA, May 27 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下３丁目３５番５８号) filed a patent application (PCT/JP2024/037370) for "EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND DISASSEMBLING METHOD" on Oct 21, 2024. With publication no. WO/2025/105118, the details related to the patent application was published on May 22, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): OTSU Masato (c...