GENEVA, June 11 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下３丁目３５番５８号) filed a patent application (PCT/JP2024/042387) for "COMPOSITION, MOLDED ARTICLE AND DEVICE" on Nov 29, 2024. With publication no. WO/2025/116025, the details related to the patent application was published on Jun 05, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): TORIHATA Yuuki (c/o DIC Corporation, Kashima Pl...