GENEVA, Feb. 4 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2024/025037) for "ADHESIVE, MULTILAYER BODY, AND PACKAGING MATERIAL" on Jul 11, 2024. With publication no. WO/2025/023032, the details related to the patent application was published on Jan 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): HIROTA Yasunobu (c/o DIC Corporation,...