INTERNATIONAL PATENT: DIAMOND FOUNDRY INCORPORATED FILES APPLICATION FOR "COMPOSITE THERMAL HOTSPOT MANAGEMENT IN DIE PACKAGING"

GENEVA, Dec. 2 -- DIAMOND FOUNDRY INCORPORATED (322 E Grand AvenueSouth San Francisco, California 94080) filed a patent application (PCT/US2024/030242) for "COMPOSITE THERMAL HOTSPOT MANAGEMENT IN DIE PACKAGING" on May 20, 2024. With publication no. WO/2025/244626, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): VAN DUREN, Jeroen (C/O Diamond Foundry inc.322 E Grand AvenueSouth San Francisco, California 94080), ROSCHEISEN, Martin (C/O Diamond Foundry inc.322 E Grand AvenueSouth San Francisco, California 94080), ZHAO, Tong...