INTERNATIONAL PATENT: DERKWOO ELECTRONICS CO., LTD., 덕우전자주식회사 FILES APPLICATION FOR "WELDING APPARATUS HAVING NON-DESTRUCTIVE THERMAL ANALYSIS FUNCTION"

GENEVA, May 19 -- DERKWOO ELECTRONICS CO., LTD. (98-23 Cheomdangieop 7-ro, Sandong-eup,Gumi-si,Gyeongsangbuk-do 39167), 덕우전자주식회사 (경상북도구미시산동읍 첨단기업7로 98-23) filed a patent application (PCT/KR2024/014994) for "WELDING APPARATUS HAVING NON-DESTRUCTIVE THERMAL ANALYSIS FUNCTION" on Oct 02, 2024. With publication no. WO/2025/100744, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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